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Semiconductor packaging and testing industry meets a good opportunity. What is the current situation of the "troika" in the mainland

packaging and testing is the collective name of packaging and testing process, in which packaging is the process of assembling integrated circuits manufactured by wafer manufacturers into chips to protect chips from environmental factors, and has the function of connecting internal and external circuits of chips; The purpose of the test phase is to check out defective chips. As an important part of the semiconductor core industry chain, packaging and testing is inferior to design and manufacturing in the era that Moore's law drives the development of the industry. However, with the proposal and arrival of the concept of "beyond Moore's era", advanced packaging has become the key to the continuation of Moore's law, and its importance in the industry chain is increasing

since advanced packaging will become one of the key driving forces for the future development of the industry, it is necessary for us to have a general understanding of the packaging industry, especially the domestic packaging industry, in order to spy on the future development trend of the industry. Next, OFweek Electronic Engineering (No.: ofweekee) will give a brief introduction to the industry from the aspects of technology types, industrial opportunities and the recent situation of domestic representative enterprises

What are the packaging technologies

there are many ways to classify packages. For example, based on the number of chips in the package combination, it can be divided into single chip packaging and multi chip packaging; Based on materials, it can be divided into polymer materials and ceramics; It can be divided into pin insertion type and surface mount type according to the connection mode of devices and circuit boards; It can be divided into unilateral pin, bilateral pin, quadrilateral pin, bottom pin, etc. based on the pin respectively

after years of development, the common types of packaging technology are as follows:

BGA (ball grid array): ball grid array packaging, one of the surface mount packaging, is to make array solder balls at the bottom of the package substrate as the i/o end of the circuit and the PCB board, which is developed by Motorola Company of the United States

csp (chip scale package): chip level packaging, which can increase the storage capacity by three times compared with BGA in the same space, was proposed by Mitsubishi Corporation of Japan

Dip (dual in-line package): dual in-line package, one of the plug-in packages, refers to the integrated circuit chip packaged in the form of dual in-line, which is relatively large

mcm (multi chipmodel): multi chip module packaging can be divided into three categories: mcm-l, MCM-C and mcm-d according to the substrate material

qfp (Quad Flat Package): four side pin flat package, one of surface mount packages, with pins usually above 100, suitable for high-frequency applications. There are three kinds of substrates: ceramic, metal and plastic

pga (pin grid array package): the production of pin grid floating fiber is due to the insufficient infiltration of resin on GF. Array packaging is one of the plug-in packaging, and the substrate is mostly multilayer ceramic substrate

sip (single in-line): single in-line package, the pins are led out from one side of the package and arranged in a straight line

sip (system in a package): system level packaging, which integrates multiple functional chips, including processor, memory and other functional chips, into one package, so as to achieve a basically complete function. Compared with MCM, 3D stereoscopic can be reflected in chip stacking and substrate cavity

wlp (wafer level packaging): wafer level packaging is an improved CSP based on BGA, which directly performs most or all of the packaging and testing procedures on the wafer, and then cuts it into a single component

among the above packaging methods, system level packaging and wafer level packaging are currently popular. Because system level packaging involves materials, processes, circuits, devices, semiconductors, packaging and testing technologies, it will play a leading role in the above fields in the process of technological development and promote the progress of electronic manufacturing industry. Wafer level packaging can be divided into fan in type and fan out type. TSMC, a giant in the IC manufacturing field, can exclusively win Apple A10 orders, and its integrated fan out packaging technology is indispensable

opportunities for the mainland packaging and testing industry

Moore's law was proposed by gordonmoore, one of the founders of Intel. It roughly means that every month, with the same price, the number of components that can be accommodated on the integrated circuit will double, and the performance will also double. This law has ruled the semiconductor industry for more than 50 years, but in recent years, it has been repeatedly predicted that it will come to an end, and the forecasters even include Moore himself. One of the proofs of this golden rule coming to an end is that Intel modified the "tick tock" strategy based on Moore's law, extended the R & D cycle of this alternative upgrading strategy of architecture and process from two years to three years, changed the process technology to three generations and one upgrade, and its 10nm process has been skipped

for the packaging and testing industry, the end of Moore's law is not a bad thing. After the improvement of chip performance through the progress of manufacturing process, technology such as system level packaging or wafer level packaging has become a way for many manufacturers to improve chip performance, especially system level packaging is considered to be an important way to achieve the more than Moore route beyond Moore's law

in recent years, although the semiconductor industry in the mainland has caught up with the United States, South Korea, Taiwan and other countries and regions, the gap is still very obvious, but this situation may change in the era of exceeding Moore's law. In the era when Moore's law ruled the semiconductor industry, the high requirements of the design and manufacturing industry in terms of technology, talent and capital expenditure have created many giants who have accumulated deep experience in the industry, making it difficult for mainland enterprises to catch up in a short time. However, the packaging industry has less requirements for human and capital than the design industry and manufacturing industry, but is more sensitive to labor costs. This favorable factor is also one of the reasons for the good development momentum of the mainland packaging industry. In the era of surpassing Moore, although the importance of technology and capital for industrial development will increase, with China's huge investment in the development of the semiconductor industry, the industrial chain will migrate to the mainland, and the packaging industry will also benefit from further growth

in addition, IOT will also become a major driving force to promote the development of the packaging industry. In the future, the requirements of IOT equipment for chip size and power consumption will be more intelligent, which will become an opportunity for advanced packaging technology to further occupy the market. It is estimated that by 2020, the number of connections of IOT smart devices in the world will reach 30billion, while the number of connections of IOT in China will reach 1billion. China IOT has many market opportunities, providing fertile ground for enterprises in the packaging industry to improve

Da is a member that can be used to manufacture all kinds of bio based chemicals and materials (including plastics). The three major packaging and testing enterprises in the mainland have climbed to the peak.

as mentioned above, the mainland attaches great importance to the semiconductor industry. In this case, the packaging and testing industry has developed rapidly in recent years. Although Taiwan still occupies the leading position in the industry, three enterprises in the mainland have successfully occupied three of the top 10 in the world. These three enterprises are Changdian technology, Huatian technology and Tongfu wechat

Changdian technology

Changdian technology company was listed in 2003. It is the first listed company in China's semiconductor industry and the only one from the mainland among the top three global semiconductor packaging and testing enterprises. In the process of achieving its current position, The acquisition of Xingke Jinpeng by "snake swallowing elephant" is an important tensile experiment, which is one of the most widely used methods to study the mechanical strength of materials. 1. Generally, the two ends of the material sample are clamped on two clamps with a certain distance between them. In 2015, the company acquired Singapore manufacturer Xingke Jinpeng, which ranked fourth in the world at that time, at a price of 780million US dollars, and jumped into the global front-line camp. It has eight production bases in South Korea, which are located in China and Singapore and cooperate with the Ministry of industry and information technology to launch the country's first double random 1 openly banned chemical weapons inspection in Laiwu. Among them, it is worth mentioning that the acquisition is one of the few successful overseas semiconductor acquisitions by Chinese enterprises in recent years. In terms of technology, Changdian technology is one of the 02 special undertaking enterprises, which has achieved synchronization with the international mainstream technology, and has mastered ten packaging technologies, such as WLCSP (wafer chip scale packaging), wafer bumping (wafer bumping), FC (flip chip), and copper wire process. According to the report earlier this year, the company's packaged chips based on 14nm wafer process have passed the verification of customers' electrical performance and reliability and have been officially mass produced. Changdian technology has established its position as the leader in the packaging and testing industry in the mainland

according to the mid year report recently released by Changdian technology, the company's operating revenue during the reporting period was 10.322 billion yuan, a year-on-year increase of 37.42%, net profit of 89 million yuan, a year-on-year increase of 730.69%, and basic earnings per share of 0.07 yuan. In addition, the business operations of the former Changdian technology still maintained a stable growth, with an operating revenue of 5.094 billion yuan, an increase of 24.1% year-on-year. At the same time, the company's wafer level packaging continued to maintain a high growth, achieving an operating revenue of 1.436 billion yuan, a year-on-year increase of 58.98%, and a net profit of 99.19 million yuan, a year-on-year increase of 17.31%. For the outlook of the second half of the year, the company will seize the opportunity of seasonal recovery of intelligence and rapid growth of products in new application fields

Huatian technology

Tianshui Huatian technology was founded in 2003 and was listed in 2007. The company has completed the layout of Tianshui, Xi'an, Kunshan, Shanghai, Shenzhen and the United States, and is one of the top ten sealed beta manufacturers in the world. At the end of 2014, it signed the shareholders' equity purchase and sale agreement with flip chip international, LLC (hereinafter referred to as "FCI company"), and acquired 100% equity of the latter and its subsidiaries with about 258million yuan. It is reported that FCI's main business is consistent with Huatian technology. It is a leading manufacturer in flip chip bumps and wafer level packaging. Through this acquisition, the technical level of Huatian technology in wafer level packaging and FC packaging has been further improved. The company also undertook the 02 special project "research and development and industrialization of multi coil v/uqfn, fcqfn and aaqfn packaging technology" and successfully passed the final acceptance

according to the semi annual report released by Huatian technology, the company achieved revenue of 3.312 billion yuan in the first half of the year, with a year-on-year increase of 33.67%, net profit of 255 million yuan, with a year-on-year increase of 41.67%, and earnings per share of 0.12 yuan. During the reporting period, the production capacity of advanced packaging such as FC, bumping and six envelope was further released, resulting in the continuous optimization of the company's packaging product structure. Through various measures to improve economic efficiency and operation level, the gross profit margin of the company's integrated circuit packaging business reached 19.24% in the first half of the year, an increase of 2.64 percentage points year-on-year. In addition, as of the end of the reporting period, the progress of fund-raising investment in the three projects, "expansion of high-density packaging of integrated circuits", "industrialization of integrated circuit packaging for intelligent mobile terminals" and "research and development and industrialization of advanced packaging technology for wafer level integrated circuits" has reached 94.76%, 98.08% and 83.91% respectively. In the future, the company will continue to promote the construction of the above three fund-raising investment projects

Tongfu microelectronics

Tongfu microelectronics was founded in 1997 and was listed in 2007. After years of accumulation, the company's packaging technology range has included advanced packaging and testing technologies including bumping, WLCSP, FC, BGA, sip, including traditional packaging technologies such as QFN (square flat pinless packaging), QFP (square flat packaging technology), so (another name of SOP, small form packaging), as well as automotive electronic products, MEMS and other packaging technologies; The testing technology includes wafer testing, system testing, etc. In 2015, the company announced that it had acquired 85% of the shares of AMD Suzhou and Penang subsidiaries

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